Laser drilling aluminum nitride and alumina substrates

Laser Drilled Ceramic Substrates

Laser drilled holes in substrates of Aluminum Nitride and Aluminum Oxide have slag which occurs when the substrate material is melted by the laser beam.

Techniques used for slag removal are:

  • Tumbling
  • Abrasive Blasting
  • Abrasive Vibratory
  • Scraping
  • Chemical Etching
  • Manual
  • Combination of several mentioned above

We have experience with all techniques mentioned and have developed new processes which eliminate damage to the substrate surface with special emphases to laser drilled holes and slots in Aluminum Nitride substrates.





















Go to

Return to Home Page: Laser hole and edge rounding, chamfering and blending

print page



Valley Design East
Phoenix Park Business Center
2 Shaker Road, Bldg. E-001
Shirley, MA 01464
Phone: 978.425.3030
Fax: 978.425.3031
Valley Design
Santa Cruz, CA 95060  
Phone: 831.420.0595  
Fax: 831.420.0592
©2015 Valley Design Corp. All Rights Reserved